Datapaq 9000 manual series#
The Endurance Series is supported by the best-in-class 4 year warranty.
Datapaq 9000 manual archive#
Endurance companion software allows you to archive your process temperatures for data analysis and sensor setup. The match function takes the guesswork out of setting the emissivity. Our innovative optional camera feature allows you to continuously monitor your process visually, while the LED sighting option allows you to see the spot size on the target and make sure you have a clean line of sight to the target. Innovative High Temperature Infrared PyrometersĮndurance IR sensors have a rugged stainless steel housing designed to meet IP65 (NEMA 4) environmental requirements in high ambients up to 65Â☌ (149Â✯) without cooling. Following are some successful real-world applications that hint at the technology’s vast potential for the industrial space It brings unfavorable conditions or in some cases, dangerous conditions, to light so that appropriate actions can be taken proactively. Or even worse, it might be due to improperly grounded current, something which puts the safety of your workers at immediate risk.įixed thermal imaging is a non-contact measurement technology designed for remote monitoring, trending, and control of temperatures. It might adversely affect your food recipes or pharma processes, resulting in bad product batches. It may signify a weakened asset surface, prior to equipment failure. Imagine an undiagnosed hot spot in your plant. Continuous temperature monitoring improves safety, product quality, productivity, and reliability.Fixed thermal imaging gains significance.Standard PWBs Micro via and Aramid (ALIVH) PWBsġ. Special attention This is flammable liquid.ġ.4 Storage and handling conditions for printed wiring boards Max storage time 6 months -40C 12 months -40C or
Storage condition Syringes must be transferred Storage temperature Refrigerator, 10 – 15 CĮnvironment in shipping Temperature +5…+25 Cĭo not store cartridges in the same positionġ.3 Storage conditions for underfill epoxy materials Temperature/humidity limits are repeatedlyġ.2 Storage and handling conditions for solder paste close to heater/cooler/humidifier/light source Cardboard box if nothing of above mentioned Air flow preventive plastic packing (vacuum ESD (Electro Static Discharge) protective MBB (Moisture Barrier Bag) for humidity SHIPPING, STORAGE AND PRODUCTION ENVIRONMENTġ.1 General shipping and storage conditionsĮxpected shipping conditions (components and materials)Ĭomponent packing level Components must be at least in the first level delivery 19ĩ.2 Feeders.19ĩ.3 NC-Programs.19ĩ.4 Part Data / Vision processing.20ĩ.5 Placement process management data compatibility table. PLACEMENT PROCESS SPECIFICATIONS.19ĩ.1 Nozzles. 17Ĩ.2 Dispencing pattern for CSP components.18ĩ. 16ħ.3 CSP rework.16ħ.4 Specifications for visual inspection error criteria, faults classification and training material.17Ĩ.
Datapaq 9000 manual manual#
MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA.15ħ.1 Manual and semi-automatic hot gas soldering and rework.15ħ.2 Manual soldering and rework using soldering iron. 13Ħ.3 Reflow profile specification.14Ħ.4 Recommended reflow oven settings.15ħ. 13Ħ.1 Profile measurement equipment.13Ħ.2 Reflow profile measurement method. AUTOMATED OPTICAL INSPECTION, AOI.12ĥ.1 Location of the machine in the production line.12ĥ.2 Utilisation of inspection results.12ĥ.3 Component and paste alarm limits.12Ħ. STATISTICAL PRINTING PROCESS CONTROL, SPPC.11Ĥ.1 Alarm and control limit settings.11Ĥ.2 Actions when the machine alarms.12Ĥ.3 Handling of statistical process information.12ĥ. 8ģ.2 Stencil.8ģ.3 Support tables.9ģ.4 Printing process parameters (stencil printing).10Ĥ. STENCIL PRINTING PROCESS SPECIFICATIONS.8ģ.1 Squeegee. 4ġ.5 Shelf life time for different component categories.5ġ.6 Drying (baking) moisture sensitive devices.6Ģ. SHIPPING, STORAGE and PRODUCTION ENVIRONMENT.2ġ.1 General shipping and storage conditions.2ġ.2 Storage and handling conditions for solder paste.2ġ.3 Storage conditions for underfill epoxy materials.3ġ.4 Storage and handling conditions for printed wiring boards.
SMT Basic process: Improving your PCBA qualityġ.
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